Highlights from IEDM 2025: 3D NAND is suddenly relevant again, interconnect metals beyond copper are emerging, 2D materials that could replace silicon, and more (SemiAnalysis)


1,000 CFETs, SK Hynix Next-Gen NAND, Interconnects Beyond Copper, 2D Materials, and More
IEDM 2025 Round-Up

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Highlights from IEDM 2025: 3D NAND is suddenly relevant again, interconnect metals beyond copper are emerging, 2D materials that could replace silicon, and more
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